11 April 2019
Qualcomm at the MWC 2019 event in Barcelona is present with several new solutions, be it the new Snapdragon 8cx 5G platform for laptops, RB3 Platform for robots, a platform for VR/AR headsets, Quick Charge for wireless power, a new chip with integrated 5G, and so on. The hottest technology is 5G and most of the announcements are made around the same. The need for the near future is speed and responsiveness and talking about these aspects comes the Wi-Fi new standard which is the Wi-Fi 6. A number of companies are now working to utilize this new standard with the help of new routers. Qualcomm is also working to push its latest Wi-Fi 6 solutions onto the market.
Qualcomm states that as we move towards a new era, technologies like 5G and Wi-Fi 6 will sustain a core part of the company’s wireless portfolio.
With the launch of new chipsets, Qualcomm has also launched the QCA6390 chipset that incorporates the support for Bluetooth 5.1 as well. This newest chip is built of a 14FF CMOS process and supports up to 1.8Gbps of Wi-Fi 6 bandwidth as well as WPA3 security and additional optional features to the Wi-Fi 6 specification. These are two optional features, one is Target Wake-Up Time allowing devices to wake quicker and use less power and 8-stream sounding which supports multiple devices doing high-data rate actions without network congestion.
Qualcomm claims that the QCA6390 consumes 50% or lower power compare to alternative solutions currently in the market being labeled as Wi-Fi 6.
With the QCA6390 chipset, Qualcomm aims to become the top chipset manufacturer for multiple wireless markets. The devices utilizing this new chipset could be mobiles, 2-in-1 tablets, smartphones, and it could even prove its worth for automotive and smartwatch sector.