10 January 2019
AMD has unveiled the next-generation Zen 2 architecture which will give rise to some new processors based on the 7nm manufacturing process. The chips will be manufactured by TSMC on its leading 7nm node, which the company says will give it a significant advantage over Intel.
During the event, AMD also provided the first real details on its 64-core/128-thread Epyc codenamed Rome.
AMD CEO Dr. Lisa Su says that the company is "betting big on 7nm" and Rome is going to be the world’s first 7nm datacenter CPU. Rome isn’t destined for the consumer market and it’s a server chip. It’s next-generation Epyc chips combined up to eight 7nm CPU “chiplets” with a central 14nm I/O die supporting 8-channel DDR4 memory and PCIe 4.0.
The multi-chip processor uses 7nm process technology for the 'Zen 2' CPU cores that benefit from the advanced process technology while leveraging a mature 14nm process technology for the input/output portion of the chip. The result is much higher performance—more CPU cores at the same power, and more cost-effective manufacture than traditional monolithic chip designs.
According to AMD, the Zen 2 architecture delivers twice the compute performance per socket and four times the floating point performance, compared to current Epyc processors. Security has also been improved with full support for data encryption as it passes from CPU to memory.
AMD will introduce the Rome in 2019. AMD also teased that the Zen 3 architecture is on the track for 2020 and will use a refined 7nm manufacturing process while maintaining forward socket compatibility.