03 May 2019
Huawei is reportedly working on making use of Substrate-Like-PCB, commonly known as SLP, circuit boards in future flagships starting with the Mate 30 lineup. The report is coming from Digitimes citing anonymous sources revealing details about the company's future plans. It is said that smartphones will undergo this change first followed by smartwatches and tablets.
As explained by 3DInCities, here is what SLP is:
"SLP is a term that attempts to describe the transition of a board into a product with package-substrate-like features. The benefits of an SLP compared to a standard or HDI board include higher line resolution, better electrical performance, and the potential for space and energy-saving, which are very important in a cramped, energy-limited smartphone environment."
If the report turns out to be true, Huawei will become the third smartphone maker to use SLP circuit boards. Apple made the switch with the iPhone X launch. Even the current-generation iPhones come with the same approach. As for Samsung, it is reported to be using SLPs for Galaxy S10 lineup which will be unveiled later this month.
It is speculated that once Huawei releases phones with SLPs, its use will become more mainstream as other OEMs are also expected to follow suit. But since there are at least a few months to go for the Mate 30 launch, we will have to wait and see if it will actually happen or not.