22 January 2020
Taiwan Semiconductor Manufacturing Company aka TSMC has officially announced its plans to build an advanced semiconductor fab in Arizona, United States. It said that the plant will be built with the mutual understanding and support of the American federal as well as state governments. It is hoping to start the project as early as 2021 i.e. next year.
As per the announcement, the plant will make use of TSMC's 5-nanometer technology for transistor chips. It is said to be capable of producing 20,000 wafers per month and generate 1,600 high-tech professional jobs directly. Even though the project will start from 2021, the actual manufacturing of chips has been estimated to begin from 2024.
The company has said an investment of about $12 billion will be made on the project. This huge investment will be made over a period of eight years between 2021 and 2029. Once completed, it will be the second manufacturing site from TSMC in the United States. The first and currently only one is situated in Camas, Washington. The company additionally has design centers in Austin, Texas, and San Jose, California.
The official statement reads,
"This U.S. facility not only enables us to better support our customers and partners, it also gives us more opportunities to attract global talents. This project is of critical, strategic importance to a vibrant and competitive U.S. semiconductor ecosystem that enables leading U.S. companies to fabricate their cutting-edge semiconductor products within the United States and benefit from the proximity of a world-class semiconductor foundry and ecosystem."
TSMC is the world's biggest contract chipmaker with clients around the world. Its biggest clients include Apple and Qualcomm with which it has been working for years. All of Apple's A-series chipsets used in the iPhone and iPad are built using components supplied by TSMC.