22 June 2022
MediaTek has announced Dimensity 1050 as its first chipset with mmWave 5G support. It is meant for future 5G smartphones that will release in the coming months. It also took the opportunity to take wraps of Dimesnity 930 and Helio G99 processors. These two processors are aimed at lower mid-range smartphones.
The Dimensity 1050 is capable of connecting with both mmWave and sub-6GHz network bands. MediaTek is claiming that the dual-band connectivity will allow the chipset to deliver faster internet speeds even in densely populated areas. The chipset will be able to switch between the two bands seamlessly depending on which one is available.
It is an octa-core CPU built using the 6nm manufacturing process. There are dual Cortex-A78 cores clocked at 2.5GHz and six Cortex-A55 cores clocked at 2.0GHz. There is Mali-G610 MC3 GPU for handling all graphics-intensive tasks. It has new tri-band WiFi support where it can work with 2.5GHz, 5GHz, and 6GHz bands along with WiFi 6E. It has compatibility with MediaTek's HyperEngine 5.0, UFS 3.1 storage, LPDDR5 RAM, Bluetooth 5.3, up to 144Hz Full HD+ display panels, and MiraVision 760.
MediaTek says we can expect Dimensity 1050 smartphones to hit the market starting in Q3 2022. It means we are barely two months away from seeing commercial product releases. It has not specified any OEM brand names as of now.
The Dimensity 930 is a chipset that will work sub-6GHz 5G bands. It will be compatible with Full HD+ display panels featuring up to 120Hz refresh rate and HDR10+. There is HyperEngine 3.0 Lite support for delivering gaming performance improvements. It will make its commercial debut in Q3 2022.
As for Helio G99, it is a processor limited to 4G LTE connectivity. It is claimed to be more power efficient than the predecessor Helio G96. MediaTek says we will start seeing the chipset in phones from Q2 2022 itself.