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Sony IMX324 is the company's latest 1/1.7-type high-res CMOS sensor

23 October 2017 3

Sony Corporation has now announced the release of IMX324, a new 1/1.7-type stacked CMOS image sensor for smartphones. The sensor has the industry’s highest resolution 7.42 effective megapixel RCC filter for forward-sensing cameras in advanced driver assistance systems (ADAS).

Sony mentions that the new sensor is almost three times the horizontal resolution of the conventional IMX224MQV sensor. The new product is even equipped with a pixel binning mode that ads multiple pixel data to raise he sensitivity further. Thus, the IMX324 is able to capture images of obstacles and pedestrians even in low-lighting conditions with a sensitivity of 2666 mV.


Even in environments with uneven, mixed levels of brightness, due to headlights and streetlights when driving at night, the sensor is equipped with a function that alternately captures dark sections at high-sensitivity settings and bright sections at high resolution, enabling high-precision image recognition when combined with the signal processing of the latter stage.

The image sensor is expected to be compatible with “EyeQ 4” and “EyeQ 5” image processors which are currently being developed by MobileEye, an Intel Company located in Israel, for use in ADAS and autonomous vehicle technology. The sensor is also set to meet the requirements of the AEC-Q100 Grade 2 reliability testing standards for automotive electronic components by June 2018. The sensor even supports functional safety requirement level ASIL B(D) for failure detection, notification, and control. The security feature even protects the output image from being altered, which is the industry’s first application of such a function in an image sensor for automotive cameras. Let’s take a look at the key specifications of the new Sony image sensor.

Model name

IMX324

Number of effective pixels

3849 (H) x 1929 (V) 7.42 megapixels

Image size

Diagonal 9.69mm (type 1/1.7)

Unit cell size

2.25um (H) x 2.25um (V)

Frame rate

Max 40fps

Sensitivity

784mV (Clear Pixel), 2666mV (pixel binning mode)

Dynamic range

120dB

Saturation signal (minimum value)

800mV

Power supply

Analog – 2.9V

Digital – 1.1V

Interface – 1.8V

Interface

MIPI CSI-2 serial output (4 lane / 2 lane)

Package

108pin plastic BGA

Package size

13.3mm x 8.97mm

Sony will ship samples of the sensor from November 2017 and will start mass production by June 2018. The price of each sample is 10,000 JPY (around $88).


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