01 August 2019
TSMC is reportedly entering 7nm EUV production this quarter and this is going to be the development of the second generation 7nm chips based on EUV lithography tech.
Currently, Apple A12, Snapdragon 855, and Kirin 980 have used the 7nm based chips and their iterations are expected to hold the upcoming advanced chips by TSMC. The report states that Huawei will be the first to utilize this tech based on EUV lithography process in its upcoming Kirin 985 SoC and if it’s true, the chip could debut with the Huawei Mate 30 series.
Also, note that TSMC is expected to be the sole supplier of Apple’s 2019 A13 processor based on 7nm EUV as well. So, Huawei and Apple would be the first two companies to make use of the new chips and after them, Qualcomm may follow for its Snapdragon processor.
The 7nm extreme ultraviolet lithography enables precise chip layouts and focuses on improving the main frequency and reducing power consumption and thus offers better battery life.
According to DigiTimes, TSMC will also introduce an enhanced version of its N7+ for the fabrication of Apple's custom-designed A13 chip so as to power the 2019 series of iPhone models. This will be dubbed as N7 Pro and the process will be ready for volume production later in the second quarter.
We would hear more about the EUV process from TSMC during its investors' meeting which is scheduled to happen on April 18.